Verfahren zur Herstellung eines Durchgangselektroden-befestigten Glassubstrats und Verfahren zur Herstellung einer elektronischen Komponente

Details

Veröffentlichungs-Nr.

EP2405471

Aktenzeichen

EP11173340

Anmeldetag

8. Juli 2011

Veröffentlichung

6. März 2013

Rechtsraum

EP

IPC

H01L21/48H01L21/50H01L23/055

Abstract

A method of manufacturing a through electrode-attached glass substrate includes: forming a plurality of electrode through holes and a dummy through hole in plate-shaped glass; inserting electrode members into the electrode through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other.

Anmelder

Firma

Seiko Instruments Inc.

Land

🇯🇵 Japan

Fachgebiete