Verfahren zur Herstellung eines Glassubstrats und Verfahren zur Herstellung elektronischer Komponenten

Details

Veröffentlichungs-Nr.

EP2405472

Aktenzeichen

EP11173343

Anmeldetag

8. Juli 2011

Veröffentlichung

29. Mai 2013

Rechtsraum

EP

IPC

H01L21/48H01L21/50H01L23/055H03H3/02

Abstract

Disclosed is a method of manufacturing a glass substrate with through electrodes, the method including: a wire stretching process in which a plurality of conductive wires are stretched in parallel between upper and lower bases; a wire burying process in which a plurality of the wires between the bases are buried by glass; an ingot formation process in which a glass ingot having the buried wires is formed by cooling the glass; a slicing process in which a glass panel is formed by slicing the glass ingot; and a polishing process in which a plurality of the wires are exposed on front and rear surfaces of the glass panel to provide the through electrodes.

Anmelder

Firma

Seiko Instruments Inc.

Land

🇯🇵 Japan

Fachgebiete