Beschichtungs- und Entwicklungsvorrichtung
Anmelder: Tokyo Electron Limited 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2405478
- Aktenzeichen
- EP11173235
- Anmeldetag
- 8. Juli 2011
- Veröffentlichung
- 5. September 2018
- Erteilung
- 5. September 2018
- Rechtsraum
- EP
- IPC
- H01L21/67
Abstract
In one embodiment, a coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a developing unit block stack which are vertically stacked on each other. Each unit block stack is composed of unit blocks vertically stacked on each other, and each unit block includes processing modules containing liquid processing modules and heating modules, each unit block is provided therein with a transport mechanism that moves along a transport passage, extending linearly from a carrier block side to an interface block side, to transport the substrate between the processing modules belonging to the unit block. First transfer units are each provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring the substrate to and from the transport mechanism of the associated coating film-forming block or developing unit block. A first transfer mechanism transfers a substrate removed from a carrier to one of the first transfer units associated with the coating film-forming unit blocks.
Anmelder
- Firma
- Tokyo Electron Limited
- Land
- 🇯🇵 Japan
Japanisches Technologieunternehmen mit Sitz in Tokio, einer der weltweit größten Hersteller von Halbleiterfertigungsanlagen. Aktiv in Beschichtungs-, Ätz- und Reinigungssystemen für die Chip- und Displayproduktion.
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Hoffmann Eitle
Hoffmann Eitle · München