Speicherelement mit einer Sicherung parallel zu einer Antifuse
Anmelder: Avago Technologies International Sales Pte. Limited, Avago Technologies General IP (Singapore) Pte. Ltd., Broadcom Corporation 🇸🇬
Details
- Veröffentlichungs-Nr.
- EP2408001
- Aktenzeichen
- EP11005601
- Anmeldetag
- 7. Juli 2011
- Veröffentlichung
- 11. September 2019
- Erteilung
- 11. September 2019
- Rechtsraum
- EP
- IPC
- H01L21/02H01L27/102H01L29/861G11C17/00G11C17/14H01L49/02// H01L27/10
Abstract
Embodiments extend the capability of fuse elements, anti-fuse elements, and combinations thereof to enable multi-time programmable memory elements. Accordingly, embodiments significantly reduce area requirements and control circuitry complexity of memory elements. Embodiments can be used in non-volatile memory storage, for example, and are suitable for use in system on chip (SoC) products. A memory element is provided and comprises a first terminal (N1) coupled to an N-doped region and a second terminal (N2) coupled to a P-doped region. The N-doped and P-doped regions form a polysilicon diode anti-fuse. A silicide layer connects the doped regions and forms a fuse in parallel with the anti-fuse.
Anmelder
- Firmen
- Avago Technologies International Sales Pte. Limited
Avago Technologies General IP (Singapore) Pte. Ltd.
Broadcom Corporation - Land
- 🇸🇬 Singapur
Singapurische Vertriebsgesellschaft des Halbleiterkonzerns Avago Technologies (heute Broadcom), tätig im internationalen Vertrieb von Halbleiterkomponenten für Kommunikations-, Industrie- und Speicheranwendungen.
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