Klebezusammensetzung, Klebefolie, Halbleitervorrichtungsschutzmaterial und Halbleitervorrichtung

Details

Veröffentlichungs-Nr.

EP2447304

Aktenzeichen

EP11008017

Anmeldetag

4. Oktober 2011

Veröffentlichung

20. November 2013

Erteilung

20. November 2013

Rechtsraum

EP

IPC

C08G77/52C09J183/14

Abstract

An object is to provide a semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and to provide an adhesive sheet using this adhesive composition. There is provided an adhesive composition comprising: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R 1 to R 4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)¤1.0; and each of X and Y is a bivalent organic group.

Anmelder

Firma

Shin-Etsu Chemical Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete