Befestigungsstruktur für ein Wärmequellenelement und wärmeleitendes Element und Verfahren zur Befestigung des Wärmequellenelements und des wärmeleitenden Elements
Anmelder: Aisin AW Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2461660
- Aktenzeichen
- EP11189496
- Anmeldetag
- 17. November 2011
- Veröffentlichung
- 27. Dezember 2017
- Rechtsraum
- EP
- IPC
- H05K7/20
Abstract
The present invention discloses a fixing structure for a heat source element, which is mounted on a circuit board accommodated in a housing, and a heat conducting member, which is accommodated in the housing, the fixing structure being configured to fix the heat source element and the heat conducting member to each other with the heat source element and the heat conducting member in abutment with each other, wherein the heat conducting member is moved toward the heat source element along a direction that is generally orthogonal to a surface of the heat conducting member for abutment with the heat source element to be brought into abutment with the heat source element; the heat source element and the heat conducting member, which have been brought into abutment with each other, are held by an elastic member to fix the heat source element and the heat conducting member to each other.
Anmelder
- Firma
- Aisin AW Co., Ltd.
- Land
- 🇯🇵 Japan
Japanischer Automobilzulieferer mit Sitz in Anjo, spezialisiert auf Automatikgetriebe und Navigationssysteme. Das Unternehmen war eine Tochtergesellschaft der Aisin-Gruppe, bevor es 2021 in die Aisin Corporation eingegliedert wurde.
2.053 Patente in unserer Datenbank