Power-Quad-Flat-No-Lead-Halbleiterpaket mit Mehrchip-Modul mit einem Leitungsrahmen für elektrische Verbindungen

Details

Veröffentlichungs-Nr.

EP2463904

Aktenzeichen

EP11165008

Anmeldetag

5. Mai 2011

Veröffentlichung

27. Februar 2019

Erteilung

27. Februar 2019

Rechtsraum

EP

IPC

H01L23/495H01L23/31

Abstract

Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost leadframes.

Anmelder

Firmen

Infineon Technologies Americas Corp.
INTERNATIONAL RECTIFIER CORPORATION

Land

🇺🇸 USA

Fachgebiete