Sensoranordnung und Verfahren zum Messen einer Nähe einer Maschinenkomponente zu einem Sender
Anmelder: General Electric Company 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2466253
- Aktenzeichen
- EP11191655
- Anmeldetag
- 2. Dezember 2011
- Veröffentlichung
- 26. August 2015
- Erteilung
- 26. August 2015
- Rechtsraum
- EP
- IPC
- G01B7/02G01B15/00
Abstract
A microwave sensor assembly (110) includes at least one probe (202) including an emitter (206) configured to generate an electromagnetic field (224) from at least one microwave signal. The emitter is also configured to generate at least one loading signal representative of a loading induced within the emitter by an object (104) positioned within the electromagnetic field. The microwave sensor assembly also includes a signal processing device (200) coupled to the at least one probe. The signal processing device includes a linearizer (222) configured to generate a substantially linear output signal based on the at least one loading signal.
Anmelder
- Firma
- General Electric Company
- Land
- 🇺🇸 USA
US-amerikanischer Technologiekonzern mit Sitz in Massachusetts. Historisch aktiv in Energieerzeugung, Luftfahrttriebwerken, Medizintechnik und Industrietechnik über verschiedene Geschäftsbereiche.
19.769 Patente in unserer Datenbank