Verfahren zur Herstellung einer organischen EL-Vorrichtung und Substrat zur Herstellung der organischen EL-Vorrichtung
Anmelder: Nitto Denko Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2475021
- Aktenzeichen
- EP12150751
- Anmeldetag
- 11. Januar 2012
- Veröffentlichung
- 9. Juli 2014
- Rechtsraum
- EP
- IPC
- H01L51/56H01L51/52
Abstract
A method for producing an organic EL device includes the steps of: preparing an adhesive sheet (2) on which a resin substrate (3) is laminated, allowing the resin substrate to adhere onto a hard substrate (9) with the adhesive sheet interposed therebetween, forming an organic EL element (10) on the resin substrate, thereby producing an organic EL device including the resin substrate and the organic EL element, and peeling the organic EL device from the hard substrate. The adhesive sheet includes a first adhesive layer (4) for being bonded to the hard substrate, and a second adhesive layer (6) formed on the first adhesive layer and bonded to the resin substrate. A non-adhesive region (19) is defined at an end portion of the resin substrate, the non-adhesive region not overlapping with the second adhesive layer but overlapping with the first adhesive layer when projected in the thickness direction.
Anmelder
- Firma
- Nitto Denko Corporation
- Land
- 🇯🇵 Japan
Japanisches Materialwissenschafts- und Chemieunternehmen mit Sitz in Osaka. Nitto Denko entwickelt Klebebänder, Folien, optische Materialien für Displays sowie Membranen und Materialien für Elektronik, Automobil und Medizintechnik.
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Hoffmann Eitle
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