MEMS-Sensor mit gepaarten seismischen Massen
Anmelder: Freescale Semiconductor, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2479579
- Aktenzeichen
- EP12151623
- Anmeldetag
- 18. Januar 2012
- Veröffentlichung
- 4. Juni 2014
- Erteilung
- 4. Juni 2014
- Rechtsraum
- EP
- IPC
- G01P15/125
Abstract
A microelectromechanical systems (MEMS) sensor (20) includes a substrate (26) and suspension anchors (34, 36) formed on a planar surface (28) of the substrate (26). The MEMS sensor (20) further includes a first movable element (38) and a second movable element (40) suspended above the substrate (26). Compliant members (42, 44) interconnect the first movable element (38) with the suspension anchor 34 and compliant members (46, 48) interconnect the second movable element (40) with the suspension anchor (36). The movable elements (38, 40) have an equivalent shape. The movable elements may be generally rectangular movable elements (38, 40) or L-shaped movable elements (108, 110) in a nested configuration. The movable elements (38, 40) are oriented relative to one another in rotational symmetry about a point location (94) on the substrate (26).
Anmelder
- Firma
- Freescale Semiconductor, Inc.
- Land
- 🇺🇸 USA
Ehemaliger US-amerikanischer Halbleiterhersteller, hervorgegangen aus einem Spin-off von Motorola, mit Schwerpunkt auf Mikrocontrollern und eingebetteten Prozessoren. Seit 2015 Teil von NXP Semiconductors.
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