Strahlungsempfindliche Resistzusammensetzung zur Herstellung von Resiststrukturen

Details

Veröffentlichungs-Nr.

EP2485090

Aktenzeichen

EP12153576

Anmeldetag

2. Februar 2012

Veröffentlichung

23. Dezember 2020

Erteilung

23. Dezember 2020

Rechtsraum

EP

IPC

G03F7/004G03F7/039G03F7/20

Abstract

A radiation-sensitive resin composition that is used to form a resist pattern using a developer that includes an organic solvent in an amount of 80 mass% or more, includes (A) an acid-labile group-containing polymer, and (B) a photoacid generator, and has a contrast value ³ of 5.0 to 30.0, the contrast value ³ being calculated from a resist dissolution contrast curve obtained when developing the radiation-sensitive resin composition using the organic solvent. The organic solvent is preferably at least one organic solvent selected from the group consisting of alkyl carboxylates having 3 to 7 carbon atoms and dialkyl ketones having 3 to 10 carbon atoms.

Anmelder

Firma

JSR Corporation

Land

🇯🇵 Japan

Fachgebiete