Beleuchtungsvorrichtung

Details

Veröffentlichungs-Nr.

EP2487995

Aktenzeichen

EP12155430

Anmeldetag

14. Februar 2012

Veröffentlichung

3. September 2014

Erteilung

3. September 2014

Rechtsraum

EP

IPC

H01L51/52

Abstract

The lighting device includes a substrate, a light-emitting element formed over one of surfaces of the substrate, and a rear surface metal layer formed on another surface of the substrate, which is opposite to the surface over which the light-emitting element is formed. The light-emitting element has a structure in which an organic compound layer containing a light-emitting substance is provided between a pair of electrodes. The substrate has a layered structure of an organic insulating layer and a metal layer including at least one internal metal layer. The internal metal layer is thermally bonded to the rear surface metal layer through a via hole formed in the organic insulating layer. The resistance of the via hole is lower than that in the case of thermal bonding not through the via hole.

Anmelder

Firma

Semiconductor Energy Laboratory Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete