Herstellungsverfahren für einen Verbinder
Anmelder: Sumitomo Wiring Systems, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2500995
- Aktenzeichen
- EP12001106
- Anmeldetag
- 20. Februar 2012
- Veröffentlichung
- 27. Dezember 2017
- Erteilung
- 27. Dezember 2017
- Rechtsraum
- EP
- IPC
- H01R43/18H01R43/24H01R13/504B29C45/33B29C45/14// B29L31/36
Abstract
An object of present invention is to suppress the formation of a molded resin portion with a primary molded article inclined and suppress the formation of voids in molded resin portion. A terminal block in which a plurality of metal conductive plates (10) to be connected to device-side busbars provided in a motor are made integral by a connector housing (50) includes a primary molded article (60) in which the plurality of conductive plates (10) are made integral by a connector housing (50); a metal plate (30) to be attached and fixed to a motor case; and a secondary molded portion (70) integrally forming the primary molded article (60) and the metal plate (30). Secondary molded portion (70) is formed by a secondary molding die including both upper and lower dies (90,91) and a slide die (92). Pairs of tightly holding portions (69), for tightly holding the slide die (92) are provided on the primary molded portion (61) before secondary molded portion (70) is formed.
Anmelder
- Firma
- Sumitomo Wiring Systems, Ltd.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen der Sumitomo-Gruppe mit Sitz in Yokkaichi. Sumitomo Wiring Systems entwickelt und fertigt Kabelbäume, Steckverbinder und elektrische Verteilersysteme vor allem für die Automobilindustrie.
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