Halbleitervorrichtung und Temperaturdatenerzeugungsverfahren
Anmelder: Renesas Electronics Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2511682
- Aktenzeichen
- EP12160958
- Anmeldetag
- 23. März 2012
- Veröffentlichung
- 19. Oktober 2016
- Erteilung
- 19. Oktober 2016
- Rechtsraum
- EP
- IPC
- G01K7/01G01K15/00G05F3/30
Abstract
Improvement in the accuracy of a temperature sensor is aimed at, suppressing the number of the test temperature in a test process. The semiconductor device comprises a coefficient calculation unit which calculates up to the N-th order coefficient (N is an integer equal to or greater than one) of a correction function as an N-th order approximation of a characteristic function indicating correspondence relation of temperature data measured by a temperature sensor unit and temperature, based on N+1 pieces of the temperature data including a theoretical value at a predetermined temperature in the characteristic function and N measured values of the temperature data measured by the temperature sensor unit at N points of temperature; and a correction operation unit which generates data including information on temperature, by performing calculation using the correction function to which the coefficients calculated are applied, based on temperature data measured by the temperature sensor unit.
Anmelder
- Firma
- Renesas Electronics Corporation
- Land
- 🇯🇵 Japan
Japanischer Halbleiterhersteller mit Sitz in Tokio, spezialisiert auf Mikrocontroller, analoge Bauelemente und Halbleiterlösungen unter anderem für die Automobil- und Industrieelektronik.
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Calderbank, Thomas Roger
NoneLondon