Substratverarbeitungssystem und Substratverarbeitungsprogramm
Anmelder: Kabushiki Kaisha Toshiba 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2518437
- Aktenzeichen
- EP12165664
- Anmeldetag
- 26. April 2012
- Veröffentlichung
- 16. August 2017
- Erteilung
- 16. August 2017
- Rechtsraum
- EP
- IPC
- G01B11/06H01L33/00G01N21/00G01N21/64G01N21/66
Abstract
According to one embodiment, a substrate processing system(100) includes a measuring unit(102c), a data processing unit(104), and a processing unit(103). The measuring unit(102c) is configured to measure information relating to a thickness dimension of a substrate(10). The substrate(10) includes a light emitting unit(2) and a wavelength conversion unit(8). The wavelength conversion unit(8) includes a phosphor. The data processing unit(104) is configured to determine processing information relating to a thickness direction of the wavelength conversion unit(8) based on the measured information relating to the thickness dimension of the substrate(10) and based on information relating to a characteristic of light emitted from the light emitting unit(2). The processing unit(103) is configured to perform processing of the wavelength conversion unit(8) based on the determined processing information.
Anmelder
- Firma
- Kabushiki Kaisha Toshiba
- Land
- 🇯🇵 Japan
Japanischer Konzern, der Elektronik, Halbleiter, Energie- und Infrastrukturtechnik sowie Industrieanlagen entwickelt und herstellt.
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Vertreten von
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Hoffmann Eitle
Hoffmann Eitle · München