Bipolare Diode und Verfahren zur deren Herstellung
Anmelder: ABB Technology AG 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP2535940
- Aktenzeichen
- EP11169792
- Anmeldetag
- 14. Juni 2011
- Veröffentlichung
- 21. August 2013
- Erteilung
- 21. August 2013
- Rechtsraum
- EP
- IPC
- H01L29/861H01L21/329H01L29/36// H01L29/06H01L29/32
Abstract
A bipolar diode (1) is provided having a drift layer (2) of a first conductivity type on a cathode side (13) and an anode layer (3) of a second conductivity type on an anode side (14). The anode layer (3) comprises a diffused anode contact layer (5) and a double diffused anode buffer layer (4). The anode contact layer (5) is arranged up to a depth of at most 5 µm and the anode buffer layer (4) is arranged up to a depth of 18 to 25 µm. The anode buffer layer (4) has a doping concentration between 8.0*10<15>and 2.0 * 10<16>cm<-3>in a depth of 5 µm and between 1.0*10<14>up to 5.0 * 10<14>cm<-3>in a depth of 15 µm, resulting in good softness of the device and low leakage current. Prior art diodes have either over all depths lower doping concentrations resulting in high leakage current or enhanced doping concentration resulting in bad softness.
Anmelder
- Firma
- ABB Technology AG
- Land
- 🇨🇭 Schweiz
Schweizerisch-schwedischer Technologiekonzern mit Sitz in Zürich. Fokussiert auf Elektrifizierung, Robotik, industrielle Automatisierung sowie Antriebstechnik für Industrie- und Energiekunden.
7.378 Patente in unserer Datenbank