Anschlussstruktur zum Anschließen einer Leiterplatte, Anschlussstück und Anschlussverfahren dafür
Anmelder: Sumitomo Wiring Systems, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2555334
- Aktenzeichen
- EP12005075
- Anmeldetag
- 9. Juli 2012
- Veröffentlichung
- 6. März 2013
- Rechtsraum
- EP
- IPC
- H01R13/03H01R12/58
Abstract
An object of the present invention is to improve connection strength between a circuit board and a terminal fitting. In a state where a board connecting portion 21 of a terminal fitting 20 is inserted in a through hole 11 of a circuit board 10, a pair of resilient deformation portions 22 formed at the board connecting portion 21 are resiliently deformed to come closer to each other and resiliently held in contact with the inner periphery of the through hole 11. Copper plating layers 25 formed on the outer surfaces of the resilient deformation portions 22 and a board-side tin plating layer 13 (tin plating layer at a side where the copper plating layer is not formed) formed on the inner peripheral surface of the through hole 11 are alloyed, whereby the board connecting portion 21 is held in the through hole 11.
Anmelder
- Firma
- Sumitomo Wiring Systems, Ltd.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen der Sumitomo-Gruppe mit Sitz in Yokkaichi. Sumitomo Wiring Systems entwickelt und fertigt Kabelbäume, Steckverbinder und elektrische Verteilersysteme vor allem für die Automobilindustrie.
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