Signalverteilung und Strahlung in einer integrierten Schaltung (IC) mit Drahtlosfunktion
Anmelder: Broadcom Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2575272
- Aktenzeichen
- EP12005673
- Anmeldetag
- 3. August 2012
- Veröffentlichung
- 11. Juni 2014
- Rechtsraum
- EP
- IPC
- H04B7/26H01L23/66H01L23/48H01L23/552H01L25/065H01P3/12H01L23/522
Abstract
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
Anmelder
- Firma
- Broadcom Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Fokus auf Kommunikations-, Netzwerk- und Speicherchips. Die ursprüngliche Broadcom Corporation ging 2016 in der heutigen Broadcom Inc. auf.
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