Vorrichtungsmodul
EP2627161
Art B1
3. April 2019
Anmelder: Hosiden Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2627161
- Aktenzeichen
- EP13250014
- Anmeldetag
- 8. Februar 2013
- Veröffentlichung
- 3. April 2019
- Erteilung
- 3. April 2019
- Rechtsraum
- EP
- IPC
- H05K5/00H03K17/96B29C45/14G06F3/044
Abstract
The invention provides an improved device module in terms of the yield rate. The device module includes a touch sensor 400 provided on a sheet 100, a connecting part 500 that is connected to the touch sensor 400 and has an external connecting portion 530, and a plastic part 300 provided on the sheet 100. The plastic part 300 embeds the touch sensor 400 and the connecting part 500 therein, and has a first opening 320 that exposes at least the external connecting portion 530 to the outside.
Anmelder
- Firma
- Hosiden Corporation
- Land
- 🇯🇵 Japan
Vertreten von
Field, Howard John
London, Großbritannien
17
Patente gesamt
9
Fachgebiete
2
Anmelder-Länder
Schwerpunkte
Weitere Vertreter
-
Gill Jennings & Every LLP
Gill Jennings & Every LLP · London
-
Beresford, Keith Denis Lewis
NoneLondon