Kupferlegierungsfolie mit Sn-Überzugsschicht für eine Passverbindungsklemme und Passverbindungsklemme

Details

Veröffentlichungs-Nr.

EP2636769

Aktenzeichen

EP13001120

Anmeldetag

6. März 2013

Veröffentlichung

23. Dezember 2015

Rechtsraum

EP

IPC

C25D5/12C25D5/50C25D7/10C25D7/00B32B15/01C22C9/02C22C9/06C22F1/08H01R13/03// C25D3/30C25D3/12C25D3/38

Abstract

A copper alloy sheet with a Sn coating layer comprises a base material made of Cu-Ni-Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 µm. Formed on the Ni coating layer is a Cu-Sn alloy coating layer having an average thickness of 0.4 to 1.0 µm. Formed on the Cu-Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 µm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 µm or more and less than 0.15 µm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu-Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Anmelder

Firma

Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

Land

🇯🇵 Japan

Fachgebiete