Elektrisch leitendes Material für Verbindungskomponente

Details

Veröffentlichungs-Nr.

EP2644750

Aktenzeichen

EP13001299

Anmeldetag

14. März 2013

Veröffentlichung

23. April 2014

Erteilung

23. April 2014

Rechtsraum

EP

IPC

C25D5/10C25D5/50H01B1/02

Abstract

An electroconductive material for a connection component have a base member made of a copper alloy plate, a Ni coating layer, a Cu-Sn alloy coating layer, and a Sn coating layer. A surface of the material is subjected to reflow treatment. The base member surface is roughened. The Cu-Sn alloy coating layer is partially exposed from the outside surface of the Sn coating layer. Regions of the Cu-Sn alloy coating layer exposed to the outside surface of the Sn coating layer have random microstructures distributed irregularly between portions of the Sn coating layer and streak microstructures extending in parallel to a rolled direction of the base member. The streak microstructures having a length of 50 µm or more and a width of 10 µm or less are contained in a number of 35 or more per 1 mm 2 .

Anmelder

Firma

Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

Land

🇯🇵 Japan

Fachgebiete