Verpackung und Verfahren zur Herstellung einer Verpackung

Details

Veröffentlichungs-Nr.

EP2654093

Aktenzeichen

EP13163043

Anmeldetag

10. April 2013

Veröffentlichung

28. November 2018

Erteilung

28. November 2018

Rechtsraum

EP

IPC

H01L33/64H01L33/62// H01L33/00H01L33/48

Abstract

A package (10) for mounting a light emitting element includes a housing (20) and a flat plate-shaped electrode (30). The electrode (30) is exposed from a lower surface of the housing (20). An upper surface of the electrode (30) includes a mounting area on which the light emitting element is mounted. An insulator (40) is arranged on the upper surface of the electrode (30). An element connector (54) is connected to the insulator (40). A tubular reflective portion (53) extends from the element connector (54) to a height corresponding to the upper surface of the housing (20). A terminal (55) is arranged on the side surface of the housing (20) and connected to the reflective portion (53). A recess (11) accommodates the light emitting element. The recess (11) is formed in an upper portion of the housing (20), and the recess (11) is formed by the upper surface of the electrode (30), the element connector (54), and the reflective portion (53).

Anmelder

Firma

Shinko Electric Industries Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete