Anschlussherstellungsverfahren und Plattenstecker
Anmelder: Sumitomo Wiring Systems, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2658035
- Aktenzeichen
- EP13001123
- Anmeldetag
- 6. März 2013
- Veröffentlichung
- 9. September 2015
- Erteilung
- 9. September 2015
- Rechtsraum
- EP
- IPC
- H01R12/58H01R13/03H01R43/16B21C1/02B21C3/00H05K3/34
Abstract
An object of the present invention is to make each printed range of solder paste smaller by reducing the amount of solder required for connection in reflow soldering, thereby making intervals between terminals smaller. The present invention concerns a manufacturing method for a terminal 10 including a board connecting portion 12 to be connected to a circular through hole B1 formed to penetrate through a board B. The manufacturing method includes a wire drawing step of manufacturing a wire material having a polygonal cross-section with obtuse interior angles by drawing the wire material through an opening of a wire drawing die, the opening having a polygonal shape with obtuse inner angles, a surface processing step of applying a surface processing to the wire material, and a cutting step of cutting the wire material having the surface processing applied thereto to a specified length to form the terminal 10.
Anmelder
- Firma
- Sumitomo Wiring Systems, Ltd.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen der Sumitomo-Gruppe mit Sitz in Yokkaichi. Sumitomo Wiring Systems entwickelt und fertigt Kabelbäume, Steckverbinder und elektrische Verteilersysteme vor allem für die Automobilindustrie.
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