Verfahren zur Herstellung eines Spulenelementes und Spulenelement

Details

Veröffentlichungs-Nr.

EP2662873

Aktenzeichen

EP13275111

Anmeldetag

3. Mai 2013

Veröffentlichung

6. April 2022

Erteilung

6. April 2022

Rechtsraum

EP

IPC

H01F41/04H01F5/00

Abstract

The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.

Anmelder

Firma

Samsung Electro-Mechanics Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete