Mehrstufiger Kühlkörper, Kühlsystem damit und Verfahren zur Steuerung davon
Anmelder: Samsung Electro-Mechanics Co., Ltd 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP2685493
- Aktenzeichen
- EP12191747
- Anmeldetag
- 8. November 2012
- Veröffentlichung
- 1. April 2015
- Rechtsraum
- EP
- IPC
- H01L23/467F28F13/12
Abstract
Disclosed herein is a multi-stage heat sink cooling system, including: at least one step surface in a direction of a surface to which cooling air is injected, wherein the step surface is any one of a step surface having a stair shape that is provided with a plurality of heat radiating plates each having a curve, a step surface provided with a plurality of heat radiating plates having a streamlined smooth curve, and a step surface provided with a plurality of heat radiating fins having a height difference. According to the preferred embodiments of the present invention, the cooling system with the multi-stage heat sink can cool heat generated from a heat radiating element using the multi-stage heat sink and the air injection part to improve a heat release rate.
Anmelder
- Firma
- Samsung Electro-Mechanics Co., Ltd
- Land
- 🇰🇷 Südkorea
Südkoreanischer Hersteller elektronischer Bauteile wie Kondensatoren, Kamerakomponenten und Leiterplatten, Teil der Samsung-Gruppe. Patente betreffen Elektronikkomponenten.
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