Umgehung für einen On-chip-Spannungsregler

Details

Veröffentlichungs-Nr.

EP2690773

Aktenzeichen

EP12177779

Anmeldetag

25. Juli 2012

Veröffentlichung

18. November 2015

Erteilung

18. November 2015

Rechtsraum

EP

IPC

H02M1/32H02M3/158H03K17/16H03K19/00H02M1/00

Abstract

The present document relates to the reduction of heat generated within an integrated circuit. In particular, the present document relates to the reduction of heat generated in driver circuits comprising voltage regulators. A circuit arrangement (100, 200) is described. The circuit arrangement (110, 200) comprises a driver circuit (110, 210) configured to generate a control signal for driving a power switch (105, 205). The driver circuit (110, 210) comprises a voltage regulator (114) configured to generate a second voltage from a supply voltage; a drive unit (116, 216) configured to generate the control signal based on the supply voltage and configured to provide the control signal to a control interface (112, 212) of the driver circuit (110, 210); and a logic component (115, 215) operating at the second voltage and drawing a second current, and configured to control the drive unit (116, 216). Furthermore, the circuit arrangement (100, 200) comprises bypass circuitry (120, 220) coupled at an input to the control interface (112, 212) and configured to provide at an output at least part of the second current to the logic component (115, 215).

Anmelder

Firma

Dialog Semiconductor GmbH

Land

🇩🇪 Deutschland

Fachgebiete