Kapazitiver Drucksensor in einer umgossenen Verpackung
Anmelder: Freescale Semiconductor, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2693184
- Aktenzeichen
- EP13177186
- Anmeldetag
- 19. Juli 2013
- Veröffentlichung
- 12. August 2015
- Rechtsraum
- EP
- IPC
- G01L19/14
Abstract
An overmolded pressure sensor package (200, 500, 600, 700, 800) is provided. The pressure sensor die (Pcell) (240, 640, 750, 850) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant (410, 510, 670, 780, 880). The Pcell cap (310, 640, 740, 840) includes a hole (330, 650, 745, 845) located away from the Pcell diaphragm (250, 635, 755, 855), so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer (310, 740) or a functional ASIC (640, 840).
Anmelder
- Firma
- Freescale Semiconductor, Inc.
- Land
- 🇺🇸 USA
Ehemaliger US-amerikanischer Halbleiterhersteller, hervorgegangen aus einem Spin-off von Motorola, mit Schwerpunkt auf Mikrocontrollern und eingebetteten Prozessoren. Seit 2015 Teil von NXP Semiconductors.
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