Quaternäres Phosphoniumsalz, Epoxidharzzusammensetzung zur Verkapselung einer Halbleitervorrichtung einschließlich des quaternären Phosphoniumsalzes und mit der Epoxidharzzusammensetzung verkapselte Halbleitervorrichtung

Details

Veröffentlichungs-Nr.

EP2746287

Aktenzeichen

EP13190489

Anmeldetag

28. Oktober 2013

Veröffentlichung

24. Mai 2017

Erteilung

24. Mai 2017

Rechtsraum

EP

IPC

C08G59/08C08G59/62C08G59/68C08K5/50C08K5/5419H01L23/29C07F9/54C08L63/00

Abstract

Disclosed herein is an epoxy resin composition for encapsulating a semiconductor device. The epoxy resin composition includes an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler. The curing accelerator includes a quaternary phosphonium salt of Formula 1: wherein R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom; X is a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom; Y is a substituted or unsubstituted C 1 -C 30 hydrocarbon group, or Si substituted with one to three substituted or unsubstituted C 1 -C 30 hydrocarbon groups; n and m are each independently an integer from 1 to 6; 1 is a number greater than 0 to 6, provided that when Y is Si, the sum of m and the number of the substituents is a maximum of 4. The epoxy resin composition has good room temperature storage stability, sufficient flowability upon curing, and high curability. Examples for salts according to the application are:

Anmelder

Firma

CHEIL INDUSTRIES INC.

Land

🇰🇷 Südkorea

Fachgebiete