Verfahren zur Herstellung einer entfernbaren Waferverbindung und Wafer-Träger-Verbund

Details

Veröffentlichungs-Nr.

EP2747130

Aktenzeichen

EP12199124

Anmeldetag

21. Dezember 2012

Veröffentlichung

11. Oktober 2017

Erteilung

11. Oktober 2017

Rechtsraum

EP

IPC

H01L21/683

Abstract

A relief structure (7) is formed on a surface (12) of a carrier (2) provided for accomodating a wafer (1), which is fastened to the carrier by a removable adhesive (3) contacting the carrier. The relief structure, which may be spatially confined to the centre of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300°C or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.

Anmelder

Firma

ams AG

Land

🇦🇹 Österreich

Fachgebiete