Mit Harz versiegelte elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP2775514

Aktenzeichen

EP13191897

Anmeldetag

7. November 2013

Veröffentlichung

21. März 2018

Erteilung

21. März 2018

Rechtsraum

EP

IPC

H01L23/24H03K17/95G01D11/24

Abstract

Degradation of post-sealing water-resistant performance is suppressed. An electronic device includes: a case member that includes a first end portion (310a) and a second end portion (310b); a flow control member (66) that includes a first opening (66a) and a second opening (66b); and a sealing resin (120) that is formed by solidification of a resin injected through a gate after the resin spreads into the case member by flowing in a first flow path between an inner surface (310k) of the case member and an outer surface (66n) of the flow control member (66) and a second flow path (66G) in the flow control member (66). Cross sectional shapes of the first flow path and the second flow path are determined such that the resin flowing in the first flow path reaches the second opening (66b) earlier than the resin flowing in the second flow path.

Anmelder

Firma

OMRON CORPORATION

Land

🇯🇵 Japan

Fachgebiete