Elektronische Vorrichtung und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP2775623

Aktenzeichen

EP13192275

Anmeldetag

11. November 2013

Veröffentlichung

31. Juli 2019

Erteilung

31. Juli 2019

Rechtsraum

EP

IPC

H03K17/945H03K17/95

Abstract

A post-sealing stress remaining in an electronic device is relaxed to detect the approach or presence of a detection target with stable accuracy. An electronic device includes a detection unit (210) configured to detect the approach or presence of the detection target, an electronic component that is electrically connected to the detection unit (210), a case member configured to accommodate the detection unit and the electronic component therein, and a sealing resin (120) that is formed in the case member. The sealing resin (120) includes a thermosetting resin portion (121) that is formed in the case member so as to seal the detection unit, and a thermoplastic resin portion (122) that is formed so as to seal a portion other than the thermosetting resin portion (121) in the case member. The thermoplastic resin portion (122) has a hardness (Shore D) of 60 or less.

Anmelder

Firma

OMRON CORPORATION

Land

🇯🇵 Japan

Fachgebiete