Verfahren zur Herstellung eines Halbleiterbauelements und Montagespannvorrichtung

Details

Veröffentlichungs-Nr.

EP2782431

Aktenzeichen

EP14159319

Anmeldetag

13. März 2014

Veröffentlichung

5. August 2020

Erteilung

5. August 2020

Rechtsraum

EP

IPC

H05K3/34H05K3/30H01L23/498H01L25/07H05K3/40H01L21/48

Abstract

The method uses a mounting jig 10 having an insulated circuit board positioning jig 11, a tubular contact element positioning jig 12 having a plurality of positioning holes 121 formed at specified positions into each of which holes a tubular contact element 6 can be inserted and a tubular contact element press-down jig 13. By the insulated circuit board positioning jig 11 and tubular contact element positioning jig 12, an insulated circuit board 2 and the tubular contact elements 6 are made positioned and the tubular contact elements 6 are soldered to the insulated circuit board 2 while being pressed down by the tubular contact element press-down jig 13. This provides a manufacturing method of a semiconductor device which is capable of mounting the tubular contact elements onto the insulated circuit board with high positioning accuracy and a mounting jig which is preferably used for mounting the tubular contact elements on the insulated circuit board.

Anmelder

Firma

Fuji Electric Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete