Lichtemittierende Vorrichtung

Details

Veröffentlichungs-Nr.

EP2797131

Aktenzeichen

EP14165717

Anmeldetag

24. April 2014

Veröffentlichung

11. November 2020

Erteilung

11. November 2020

Rechtsraum

EP

IPC

H01L33/62// H01L33/54H01L33/48H01L23/00

Abstract

A provided light includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.

Anmelder

Firma

Nichia Corporation

Land

🇯🇵 Japan

Fachgebiete