Steckverbinder und Aufbauverfahren
Anmelder: Acer Incorporated 🇹🇼
Details
- Veröffentlichungs-Nr.
- EP2797181
- Aktenzeichen
- EP13175979
- Anmeldetag
- 10. Juli 2013
- Veröffentlichung
- 14. September 2016
- Erteilung
- 14. September 2016
- Rechtsraum
- EP
- IPC
- H01R39/64G06F1/16// H01R12/52H01R107/00
Abstract
A connector used for connecting to substrates and including bases and a shaft is provided. The bases are disposed on the substrates individually and include terminals embedded the base. The shaft is pivoted to the bases and includes a first element, a second element stacking with the first element and conductive rings. The second element includes first and second conductive circuits. The first conductive circuits are connected to the second conductive circuit, and each first and each second conductive circuit has a first pad and a second pad on the second element. The conductive rings are sleeved to the shaft, and connected to the first pad and the second pad electrically and individually. When the shaft is rotatably assembled to the bases, the first pads and the second pads are contact with the terminals electrically via the conductive rings and the conductive rings are capable of contacting with the terminals.
Anmelder
- Firma
- Acer Incorporated
- Land
- 🇹🇼 Taiwan
Taiwanischer Elektronikkonzern aus Taipeh, Hersteller von Notebooks, Desktop-Computern, Monitoren und weiteren IT- und Unterhaltungselektronikprodukten.
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