Halbleitergehäuse

Details

Veröffentlichungs-Nr.

EP2840606

Aktenzeichen

EP14180133

Anmeldetag

7. August 2014

Veröffentlichung

6. Mai 2015

Rechtsraum

EP

IPC

H01L23/498

Abstract

A semiconductor package (100, 300, 500, 700, 900A, 900B, 1000A, 1000B) comprises a substrate (120, 520, 920A, 920B, 1020) comprising a top surface and a back surface, a semiconductor chip (110) having a plurality of functions and mounted on the top surface of the substrate (120, 520, 920A, 920B, 1020), and a plurality ofballs (130, 330, 530, 730, 930A, 930B, 1030A, 1030B) formed on the back surface of the substrate (120, 520, 920A, 920B, 1020) configured to connect the substrate (120, 520, 920A, 920B, 1020) to an external substrate of the semiconductor package (100, 300, 500, 700, 900A, 900B, 1000A, 1000B). The substrate (120, 520, 920A, 920B, 1020) further comprises a plurality of electrodes (121, 521) that correspond to the plurality of functions and are formed on the back surface of the substrate (120, 520, 920A, 920B, 1020), and a subset of the plurality of electrodes (121, 521) corresponds to a subset of the plurality of functions, and each of the plurality of balls (130, 330, 530, 730, 930A, 930B, 1030A, 1030B) is respectively disposed on each of the electrodes in the subset.

Anmelder

Firma

Funai Electric Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete