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EP2860284 Art B1 14. Dezember 2016

Anmelder: Ibiden Co., Ltd. 🇯🇵

Details

Veröffentlichungs-Nr.
EP2860284
Aktenzeichen
EP14188280
Anmeldetag
9. Oktober 2014
Veröffentlichung
14. Dezember 2016
Erteilung
14. Dezember 2016
Rechtsraum
EP
IPC
C23C24/00C23C26/00C23D5/02F01N13/00F01N13/14C03C8/14C23D5/00C03C8/20F01N13/10F01N13/16
Offizieller Volltext

Abstract

The present invention provides a structure including a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal, and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer that is formed from an amorphous inorganic material and particles of a crystalline inorganic material, and covers the surface of the base, the surface coat layer including a first coat portion covering the flat portion and a second coat portion covering the at least one of a bump and an edge portion, the surface coat layer having a thickness ratio of the second coat portion to the first coat portion (second coat portion thickness/first coat portion thickness) of from 0.4 to less than 1.0, the particles of the crystalline inorganic material having an average particle size of from 0.1 to 50 µm.

Anmelder

Firma
Ibiden Co., Ltd.
Land
🇯🇵 Japan
🇯🇵 Ibiden

Ibiden ist ein japanischer Hersteller elektronischer Materialien mit Sitz in Ogaki, spezialisiert auf IC-Substrate für Halbleiter sowie Keramikprodukte für die Automobil- und Elektronikindustrie.

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