Struktur zur Bildung einer Oberflächenbeschichtung
Anmelder: Ibiden Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2860286
- Aktenzeichen
- EP14188277
- Anmeldetag
- 9. Oktober 2014
- Veröffentlichung
- 7. Dezember 2016
- Erteilung
- 7. Dezember 2016
- Rechtsraum
- EP
- IPC
- C23D5/02F01N13/08C23C24/00C23D5/00F01N13/14C03C8/14
Abstract
The present invention provides a structure including a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal, and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer that is formed from an amorphous inorganic material and particles of a crystalline inorganic material, and covers the surface of the base, the surface coat layer including a first coat portion covering the flat portion and a second coat portion covering the at least one of a bump and an edge portion, the surface coat layer having a thickness ratio of the second coat portion to the first coat portion (second coat portion thickness/first coat portion thickness) of from 0.4 to less than 1.0, the particles of the crystalline inorganic material constituting from 5 to 70% by weight of the whole of the surface coat layer.
Anmelder
- Firma
- Ibiden Co., Ltd.
- Land
- 🇯🇵 Japan
Ibiden ist ein japanischer Hersteller elektronischer Materialien mit Sitz in Ogaki, spezialisiert auf IC-Substrate für Halbleiter sowie Keramikprodukte für die Automobil- und Elektronikindustrie.
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Hoffmann Eitle
Hoffmann Eitle · München