Organisches Dilsulfid-basierende Behandlungslösung für eine Gold- oder Goldlegierungsoberfläche und Verfahren davon

Details

Veröffentlichungs-Nr.

EP2878702

Aktenzeichen

EP14195604

Anmeldetag

1. Dezember 2014

Veröffentlichung

30. August 2017

Erteilung

30. August 2017

Rechtsraum

EP

IPC

C23C22/03C25D5/48C23F11/10C23F11/16H05K3/28C23C22/02C23C22/05C23C22/60

Abstract

To provide a surface treatment solution and treatment method for gold or gold alloy plating that effectively suppresses corrosion of underlying metal or substrate metal from pinholes that develop on the gold or gold alloy plating film. [Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ X 1 O 3 S-R 3 -S-S-R 4 -SO 3 X 2 €ƒ€ƒ€ƒ€ƒ€ƒ(2) in the formula, R 3 and R 4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R 3 and R 4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X 1 and X 2 represent monovalent cations.

Anmelder

Firma

Rohm and Haas Electronic Materials LLC

Land

🇺🇸 USA

Fachgebiete