Elektronische Vorrichtung
Anmelder: OMRON CORPORATION 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP2884826
- Aktenzeichen
- EP14189826
- Anmeldetag
- 22. Oktober 2014
- Veröffentlichung
- 14. August 2019
- Erteilung
- 14. August 2019
- Rechtsraum
- EP
- IPC
- H05K5/06H03K17/95G01D11/24
Abstract
Provided is an electronic device (510) that prevents running-out of a filling resin from an opening (e.g., an injection gate (81)) due to thermal expansion, even when the device is manufactured using a resin having a linear expansion coefficient of at least 90×10 -6 /°C (90 ppm/°C) (e.g., a hot melt resin), and is used under a high-temperature environment (e.g., 50°C or more). The electronic device (510) is provided with a filling resin confining surface inside of the casing (60; 60K; 60L; 60M), and the filling resin confining surface includes a position opposite to the gate (81) and a region that has a distance to an inner surface (63; 63M) of the casing (60; 60K; 60L; 60M) of at least 0.2 mm and at most 1.0 mm, and that has an area of at least four times larger than the cross-sectional area of the gate (81).
Anmelder
- Firma
- OMRON CORPORATION
- Land
- 🇯🇵 Japan
Japanisches Technologieunternehmen mit Sitz in Kyoto. Omron entwickelt Automatisierungstechnik, Steuerungen, Sensoren und Robotik für die Industrie sowie elektronische Bauteile und medizintechnische Geräte.
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