Systeme und Verfahren zum Anschließen einer integrierten Vorrichtung einer Automatisierungsvorrichtung an einem Kühlkörper

Details

Veröffentlichungs-Nr.

EP2891808

Aktenzeichen

EP15150014

Anmeldetag

2. Januar 2015

Veröffentlichung

14. April 2021

Erteilung

14. April 2021

Rechtsraum

EP

IPC

F16B31/02// H01L23/40H01L23/42H01L21/48

Abstract

A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.

Anmelder

Firma

Rockwell Automation Technologies, Inc.

Land

🇺🇸 USA

Fachgebiete