Zerteilungsverfahren

Details

Veröffentlichungs-Nr.

EP2908335

Aktenzeichen

EP14155240

Anmeldetag

14. Februar 2014

Veröffentlichung

15. April 2020

Erteilung

15. April 2020

Rechtsraum

EP

IPC

H01L21/768H01L21/78

Abstract

The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.

Anmelder

Firma

ams AG

Land

🇦🇹 Österreich

Fachgebiete