Kopfteil-Unteranordnungen
Anmelder: Rosemount Aerospace Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2933621
- Aktenzeichen
- EP15163832
- Anmeldetag
- 16. April 2015
- Veröffentlichung
- 20. Februar 2019
- Erteilung
- 20. Februar 2019
- Rechtsraum
- EP
- IPC
- G01L19/00// G01L19/14H01R13/504H01R4/02
Abstract
A dielectric header sub-assembly includes a header body (202) with opposed first (208) and second (210) surfaces and a side wall (212). The first and second surfaces define a header axis (A) extending therebetween. The side wall extends from the first surface to the second surface. The second surface includes a tapered portion (214). A dielectric header sub-assembly includes a bore (213). The bore extends from the first surface to the second surface. A first bore opening (224) of the bore proximate to the first surface is greater in area than a second bore opening (226) of the bore proximate the second surface. A method of assembling a header sub-assembly includes inserting an electrical connector (215) into a bore of a header body, applying an active braze filler material (228) into the bore and applying heat to braze the active braze filler material to the header body and the electrical connector.
Anmelder
- Firma
- Rosemount Aerospace Inc.
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen, Teil von Collins Aerospace. Rosemount Aerospace entwickelt Sensoren und Messsysteme für Luftfahrzeuge, unter anderem für Luftdaten und Vereisungserkennung.
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