Sensorsystem mit Vollbrückenkonfiguration von vier resistiven Sensorelementen
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP2955492
- Aktenzeichen
- EP14172427
- Anmeldetag
- 13. Juni 2014
- Veröffentlichung
- 10. Mai 2017
- Erteilung
- 10. Mai 2017
- Rechtsraum
- EP
- IPC
- G01D18/00
Abstract
It is described a sensor system (100, 200, 300) comprising (a) a first sensor path (110) comprising a first sensing element (111) and a second sensing element (112) being connected in series between a first supply terminal (st1) and a second supply terminal (st2) and an intermediate node (in, in1) being provided in between the first supply terminal (st1) and the second supply terminal (st2), (b) a second sensor path (120) comprising (b1) a third sensing element (123) and a fourth sensing element (124) being connected in series between the first supply terminal (st1) and the second supply terminal (st2), wherein the third sensing element (123) is subdivided into a first third subcomponent (R3a) and a second third subcomponent (R3b) and the fourth sensing element (124) is subdivided into a first fourth subcomponent (R4a) and a second fourth subcomponent (R4b), (b2) a first reference node (rn1) being provided in between the first supply terminal (st1) and the second supply terminal (st2), and (b3) a second reference node (rn2) being provided in between the first supply terminal (st1) and the second supply terminal (st2) and being different from the first reference node (rn1), and (c) a processing unit (150, 250, 350) receiving an input signal (vinp) from the intermediate node (in, in1), a first reference signal (vrefp) from the first reference node (rn1), and a second reference signal (vrefh) from the second reference node (rn2) and being configured for providing a sensor output signal (dout) based on the input signal (vinp), the first reference signal (vrefp) and the second reference signal (vrefn).
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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Fachgebiete
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Terblanche, Candice Jane
NoneRedhill