Gehäuse einer Integrierten Schaltung mit einer Struktur zur Verminderung von Stress

Details

Veröffentlichungs-Nr.

EP2983201

Aktenzeichen

EP15178842

Anmeldetag

29. Juli 2015

Veröffentlichung

28. Juni 2017

Erteilung

28. Juni 2017

Rechtsraum

EP

IPC

H01L23/31

Abstract

The present invention provides an integrated circuit (IC) package (200, 400) with stress releasing structure. The IC package (200, 400) comprises: a metal plane (202, 402), a substrate (204, 404), an IC chip (206, 406), and an IC fill layer (208, 408). The metal plane (202, 402) has at least one first etching line for separating the metal plane (202, 402) into a plurality of areas. The substrate (204, 404) is formed on metal layer. The IC chip (206, 406) is formed on the substrate (204, 404), and the IC fill layer (208, 408) is formed around the IC chip (206, 406). The at least one first etching line forms at least one half cut line in the metal plane (202, 402) and the substrate (204, 404).

Anmelder

Firmen

MediaTek Inc.
MediaTek, Inc

Land

🇹🇼 Taiwan

Fachgebiete