Vorrichtung und zugehörige Verfahren für verformbare Elektronik

Details

Veröffentlichungs-Nr.

EP2991460

Aktenzeichen

EP14182953

Anmeldetag

29. August 2014

Veröffentlichung

21. November 2018

Erteilung

21. November 2018

Rechtsraum

EP

IPC

H05K1/02H05K3/10H05K7/06

Abstract

An apparatus (101, 301) comprising a deformable substrate (102,202,302), an electrical interconnect (103,203,303) suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam (104,204,304) configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections (105,305) and adjoining straight sections (308), and wherein the electrical interconnect is attached to the support beam (104,204,304) via the adjoining straight sections (308) such that the one or more curved sections (105,305) are suspended over the deformable substrate (102,202,302) to enable the electrical interconnect (103,203,303) to accommodate strain when the deformable substrate (102,202,302) undergoes operational deformation.

Anmelder

Firmen

Nokia Technologies Oy
Nokia Technologies OY

Land

🇫🇮 Finnland

Fachgebiete