Waferverarbeitungslaminat, Temporäres Klebematerial zur Waferverarbeitung und Verfahren zur Herstellung eines Dünnen Wafers

Details

Veröffentlichungs-Nr.

EP3000596

Aktenzeichen

EP15002674

Anmeldetag

15. September 2015

Veröffentlichung

12. Juli 2017

Erteilung

12. Juli 2017

Rechtsraum

EP

IPC

B32B7/12C08G77/04C08G77/14C09J183/04C09J183/14H01L21/683C08G77/00B32B7/06C08G77/52C08G77/50

Abstract

The present invention is directed to a wafer processing laminate including a support (3), a temporary adhesive material layer (2) formed on the support (3), and a wafer (1) laminated on the temporary adhesive material layer (2), the wafer (1) having a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer (2) includes a complex temporary adhesive material layer having a two-layered structure that includes a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) having a film thickness of less than 100 nm and a second temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (B), the first temporary adhesive layer (A) being releasably laminated to the front surface of the wafer (1), the second temporary adhesive layer (B) being releasably laminated to the first temporary adhesive layer (B) and the support (3). There can be provided a temporary adhesive material for a wafer processing which can withstand a thermal process at a high temperature exceeding 300°C, and facilitates temporary adhesion and delamination, and further provided a wafer processing laminate capable of increasing productivity of thin wafers.

Anmelder

Firma

Shin-Etsu Chemical Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete