Automatisches Bauteilladesystem
Anmelder: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Shenzhen) Co. Ltd., Shenzhen AMI Technology Co., Ltd 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP3015219
- Aktenzeichen
- EP15192299
- Anmeldetag
- 30. Oktober 2015
- Veröffentlichung
- 18. September 2019
- Erteilung
- 18. September 2019
- Rechtsraum
- EP
- IPC
- B23Q7/14B23Q16/06H05K13/00
Abstract
An automatic component loading system includes: a loading device configured to pick up respective components based on a preset program; a conveying device provided with a plurality of first trays for receiving the components and configured so that the plurality of first trays each is circularly moved between a loading position and an unloading position to allow the loading device to load the picked components on the first tray at the loading position; and a position correcting device configured to drive the conveying device or each first tray to move in a case where each first tray deviates from its loading position, so as to position the first trays at the respective loading positions thereof. In this way, it may ensure that the first tray on which components to be loaded is accurately and efficiently positioned at its loading position, and the components may be accurately loaded on respective locations of the first tray, facilitating a subsequent operation to automatically grip the components.
Anmelder
- Firmen
- Tyco Electronics (Shanghai) Co. Ltd.
Tyco Electronics (Shenzhen) Co. Ltd.
Shenzhen AMI Technology Co., Ltd - Land
- 🇨🇳 China
Der Anmelder ist eine chinesische Gesellschaft aus dem Tyco-Electronics-Konzern, der Vorläuferorganisation des heutigen TE-Connectivity-Konzerns, mit Fertigungs- und Entwicklungsstandort in Shanghai. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Optik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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