Bodenplatte für ein Flugzeug und Flugzeug mit solch einer Bodenplatte
Anmelder: Airbus Operations GmbH 🇩🇪
Details
- Veröffentlichungs-Nr.
- EP3015360
- Aktenzeichen
- EP14190827
- Anmeldetag
- 29. Oktober 2014
- Veröffentlichung
- 29. Mai 2019
- Erteilung
- 29. Mai 2019
- Rechtsraum
- EP
- IPC
- B32B5/24B64C1/18F24D13/02H05B3/34
Abstract
Described and illustrated is a floor panel (1) for an aircraft, said floor panel (1) comprising a panel structure (3) for transmitting forces applied to the floor panel (1), wherein the panel structure (3) includes an upper cover layer (7), a lower cover layer (9), and a core assembly (11) sandwiched between the upper and lower cover layers (7, 9), and a heater layer (5) for heating the floor panel (1), wherein the heater layer (5) is provided between the upper and lower cover layers (7, 9). The object of the present invention, to provide a possibly simple heated floor panel for an aircraft, wherein the risk of overheating and at the same time the risk of local hot spots at the heater layer is reduced, is achieved in that the heater layer (5) is formed as a PTC-layer having a plurality of electric conductor paths (27) interconnected to one another by a plurality of PTC-resistor paths (29) comprising a PTC-material, wherein the electric resistance of said PTC-Material increases with increasing temperature.
Anmelder
- Firma
- Airbus Operations GmbH
- Land
- 🇩🇪 Deutschland
Deutsche Tochtergesellschaft des europäischen Luft- und Raumfahrtkonzerns Airbus mit Standorten wie Hamburg. Entwickelt und fertigt Flugzeugstrukturen und Komponenten für die zivile Luftfahrt.
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