Vorrichtung und zugehörige Verfahren zur Montage von elektronischen Komponenten auf verformbare Substrate

Details

Veröffentlichungs-Nr.

EP3018705

Aktenzeichen

EP14191680

Anmeldetag

4. November 2014

Veröffentlichung

22. August 2018

Erteilung

22. August 2018

Rechtsraum

EP

IPC

H01L23/00

Abstract

An apparatus comprising: a deformable substrate, the substrate configured to allow for electrical connection of one or more substrate electronic components mounted on the deformable substrate to at least one of: one or more other electronic components mounted on the deformable substrate, and one or more other electronic components mounted on another connected substrate; and one or more substrate electronic components mounted on the deformable substrate by an interconnect, the interconnect configured to electrically and mechanically interconnect the one or more substrate electronic components to the deformable substrate; wherein the interconnect comprises an ion gel, the ion gel configured to: electrically interconnect the one or more substrate electronic components to the deformable substrate by capacitive coupling; mechanically interconnect the one or more substrate electronic components to the deformable substrate by adhesion, and maintain the electrical and mechanical interconnection of the one or more substrate electronic components under operational strains of the deformable substrate.

Anmelder

Firmen

Nokia Technologies Oy
Nokia Technologies OY

Land

🇫🇮 Finnland

Fachgebiete