Verpackungssubstrat mit Blockartiger Durchkontaktierung und Halbleiterpackungen damit

Details

Veröffentlichungs-Nr.

EP3024022

Aktenzeichen

EP15192247

Anmeldetag

30. Oktober 2015

Veröffentlichung

15. Mai 2019

Erteilung

15. Mai 2019

Rechtsraum

EP

IPC

H01L23/367H01L23/498H01L23/50

Abstract

A packaging substrate (100) includes a core layer (200) having a first surface (200a) and a second surface (200b). A group of ground pads (210) is disposed on the second surface (200b) within a central region (101). A group of first power pads (220) is disposed on the second surface (200b) within the central region (101). A plurality of signal pads (240) is disposed on the second surface (200b) within a peripheral region (102) that encircles the central region (101). A first block-type via (110) is embedded in the core layer (200) within the central region (101). The group of ground pads (210) is electrically connected to the first block-type via (110). A second block-type via (120) is embedded in the core layer (200) within the central region (101). The group of first power pads (220) is electrically connected to the second block-type via (120).

Anmelder

Firmen

MediaTek Inc.
MediaTek, Inc

Land

🇹🇼 Taiwan

Fachgebiete